Product Description

FEATURES

• For surface mounted application

• Low profile package

• High efficiency

• Glass Passivated Chip Juntion

• Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA

• Case: SOD-123FL

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight:15mg 0.00048oz

Payment Terms︰ T/T