FEATURES
• For surface mounted applications in order to optimize board space.
• Low profile package
• Glass passivated junction
• Low inductance
• Plastic package has Underwriters Laboratory Flammability
MECHANICAL DATA
▪Case: SOD-123FL
▪Terminals: Solderable per MIL-STD-750, Method 2026
▪Approx. Weight:15mg 0.00048oz