Product Description

FEATURES

• For surface mounted applications

• Low profile package

• Superfast reverse recovery time

• Glass Passivated Chip Junction

• Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA

• Case: SMAF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight: 27mg / 0.00095oz

Payment Terms︰ T/T