FEATURES
• For surface mounted applications
• Low profile package
• Superfast reverse recovery time
• Glass Passivated Chip Junction
• Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 27mg / 0.00095oz
