Features
● Low profile package
● Ideal for automated placement
● Glass passivated chip junctions
● Fast switching for high efficiency
● High forward surge capability
● High temperature soldering: 260℃/10 seconds at terminals
● Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
● Case: JEDEC DO-214AA molded plastic body over glass passivated chip
● Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
● Polarity:Laser band denotes cathode end