Features
● Low profile space
● Ideal for automated placement
● Glass passivated chip junctions
● Low forward voltage drop
● Low leakage current
● High forward surge capability
●High temperature soldering： 260℃/10 seconds at terminals
● Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
● Case:JEDEC DO-214AC (SMA) molded plastic body over glass passivated chi
● Terminals:Solder plated, solderable per J-STD-002B and JESD22-B102D
● Polarity:Laser band denotes cathode end
